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| Identification |
| Molecular Structure |
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CAS No. |
2618-96-4 |
| Molecular Formula |
C12H11NO4S2 |
| Molecular Weight |
297.34 |
| Name |
Bis(benzene sulphonyl)imide |
| Synonymous |
Dibenzenesulfonimide; N-(Phenylsulphonyl)benzenesulphonamide; BBI |
| Properties |
| Melting Point |
150-155 ºC
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| Safety & Transportation Information |
| Harzard Symbols |
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| Hs code |
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| Supplier Specification |
| Appearance |
White powder
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| Purity |
85%+
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| Packages |
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| Productivity |
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| Storage |
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| Notes |
Sulfonylimide compound, it has physical characteristic of sulfonyl imide soluble in alkaline solution. In electroplating, it is used as primary brightener instead of saccharin, it has better leveling ability and less consumption than saccharin.
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